Press Releases

2018-2023 Advanced Packaging Market Share According to: Product types, Application, Focused Regions, Forecast – 2023

Advanced Packaging

Advanced Packaging Market report provides emerging opportunities in the market and the future impact of major drivers and challenges and, support decision makers in making cost-effective business decisions. Advanced Packaging Market analyse factors that effect demand for Advanced Packaging, driving factors, trends, and challenges faced by industry vendors, regional analysis, Segment by Type, Applications of whole Advanced Packaging industry.

Get Sample PDF of Advanced Packaging Market Report @ https://www.360researchreports.com/enquiry/request-sample/13102960

Description of Advanced Packaging Market: The global advanced packaging market was valued at USD 3,358.1 million in 2017, and it is expected to reach a value of USD 6,254.6 million by 2023, at a CAGR of 10.5% during the forecast period (2018 – 2023). IC packaging in the semiconductor industry has witnessed continuous transformation in terms of characteristics, integration and energy efficiency of the product, owing to a vast demand across various end-user verticals of the industry. The 2-D integrated circuit (2.0DIC) flip-chip and wafer-level packaging technologies have witnessed solid growth over the years owing to a number of mainstream applications – primarily in high-end smartphones and tablets – that are expected to meet stringent size and power-management requirements. The 2.5DIC and 3.0DIC through silicon via (TSV) technology have emerged as attractive options to extend the flip-chip and wafer-level capabilities owing to their enhanced functionality. A majority of the IC manufacturers manage the front-end, while the middle- and back-end activities are performed by foundries that mainly specialize in outsourced assembly and testing (OSAT).

Growing Trend of Miniaturization Is Driving the Market

The industry has always been witnessing constant transitions, miniaturization of nodes and increasing size of wafers owing to the ULSI fabrication are driving the market growth. Increasing number of manufacturers offering innovative products are increasing as the companies are focused toward R&D. Growing consumer electronic users and consumer preference toward smaller, lighter and thinner products, with increased demand for tablets, smartphones and other connected devices, along with the increasing need for advanced architecture in electronic products, are also fueling the growth of this market.

Wafer-Level Chip-Scale Packaging Is the Fastest Growing Technology

Innovations in the semiconductor packaging technology are majorly based on the size of the wafer, thereby raising focus on the wafer-level packages, which has resulted in innovative packaging solutions in the chip industry. Manufacturers are keenly focused on the production of larger diameter wafers owing to the increasing demand. This is expected to reduce the costs incurred in manufacturing, and hence, is expected to lead to the development of advanced packaging solutions. The Fan out sub-segment technology is an emerging alternative solution to the 2.5D packaging, it can also handle multiple dies when compared to the fan-in wafer-level packaging, which can handle single die only. Fan-out technology is witnessing significant growth, as this eliminates the need for process flows that includes water fluxing, cleaning, curing, flip-chip assembly and under-fill dispensing.

Asia-Pacific Is Expected to Witness High Growth Rates

Asia-Pacific is expected to grow at a healthy rate, being a major revenue generating region during the forecast period. Presence of major players in this region and heavy investments in R&D for developing products with advanced features is fueling the growth of this market. China is a major contributor in this region, mainly driven by the policy framework released by the State Council of the People’s Republic of China in June 2014. This policy aims to make advanced packaging a technology priority across the semiconductor industry. To cater to the various advancements in consumer applications, such as, smartphones, tablets and wearable products, the MEMS and CIS markets are expected to exhibit robust growth during the forecast period, in turn, fueling the growth of the advanced packaging market. The growing demand for mobile/wireless sensor, CIS (Cogent Iris Scanner) and fingerprint sensors is expected to propel the Copper pillar and WLCSP growth in the region.

Global Advanced Packaging Market: Manufacturers Segment Analysis (Company and Product introduction, Advanced Packaging Sales Volume, Revenue, Price and Gross Margin):

  • Amkor Technology Inc.
  • Taiwan Semiconductor Manufacturing Company
  • STATS ChipPAC Ltd
  • Advanced Semiconductor Engineering Inc.
  • United Microelectronics Corporation
  • Semiconductor Manufacturing International Corporation

    Advanced Packaging Market report passes on a fundamental overview of the Market including its definition, applications and advancement. Furthermore, the Industry report investigates the ecumenical Major Advanced Packaging Market players in detail. Advanced Packaging Market report gives key bits of Cautiousnessand subsisting status of the Players and is a basic Source obviously and heading for Companies and people energized by the Industry.

    Ask for Pre-Order [email protected] https://www.360researchreports.com/enquiry/pre-order-enquiry/13102960

    Reasons to Purchase this Report

  • Trend of miniaturization as a driver to the global market scenario
  • Analyzing various perspectives of the market with the help of Porter’s five forces analysis
  • Technology expected to dominate the market
  • Regions expected to witness growth during the forecast period
  • Latest developments, market shares and strategies employed by the major market players
  • 3-month analyst support, along with the Market Estimate sheet (in Excel)

    The Global demand for Advanced Packaging Market is forecast to report strong development driven by consumption in major evolving markets. More growth opportunities to come up between 2018 and 2025 compared to a few years ago, signifying the rapid pace of change.

    Advanced Packaging Market Historic Data (2012-2018):

    • Industry Trends: Status and Outlook.
    • Competitive Landscape: By Manufacturers, Development Trends.
    • Product Revenue for Top Players: Market Share, Growth Rate, Current Market Situation Analysis.
    • Market Segment: By Types, By Applications, By Regions/ Geography.
    • Sales Revenue: Market Share, Growth Rate, Current Market Analysis.

    Advanced Packaging Market Forecast (2018-2025):

    • Market Size Forecast: Overall Size, By Type/Product Category, By Applications/End Users, By Regions/Geography.
    • Key Data (Revenue): Market Size, Market Share, Growth Rate, Growth, Product Sales Price.

    Advanced Packaging Market Influencing Factors:

    • Market Environment: Government Policies, Technological Changes, Market Risks.
    • Market Drivers: Growing Demand, Reduction in Cost, Market Opportunities and Challenges.

    Purchase Report @ https://www.360researchreports.com/purchase/13102960

    In addition, company-to-company comparison (Company benchmarking) and product-to-product comparison (Product benchmarking) are included in the research work. It presents key competitive factors that are vital for companies to excel in challenging market conditions.